4-inch 128 PCS IC Chip Tray with 0.2mm Flatness for Precision Storage and Transportation

Custom Geometry Permanent Antistatic Precision Waffle Pack Chip Trays

This is a highly specialized, customizable waffle pack chip tray, focusing on applications where component geometry is irregular and requires maximum protection and precision alignment. While it adheres to the industry-standard 2-inch and 4-inch footprints, its core value lies in the tailored, precision-molded pocket design. It is engineered not just for standard rectangular die, but specifically for photonic elements, complex optical components, and semiconductor die with unique or irregular geometries that possess sensitive surface features (e.g., lenses, terminals, solder balls). The tray is manufactured from a permanent antistatic/conductive polymer, ensuring continuous and reliable ESD protection without relying on temporary surface treatments. Crucially, the tray’s geometry is optimized through the use of advanced techniques like Moldflow analysis, guaranteeing an extremely stable size and high degree of flatness. This stability is essential for processes like optical inspection where component pitch and coplanarity are critical. The robust construction and material purity (suitable for Class 10-1000 cleanrooms) make this waffle pack an ideal, high-end packaging solution for R&D projects and specialized production where off-the-shelf carriers simply cannot provide the necessary component support and feature protection.

Features:

• Precision Pocket Customization
• Permanent Antistatic Protection
• Optimized for Irregular Geometries
• Superior Flatness and Dimensional Stability
• Adaptable to Automation (Chamfers & Tapers)
• Protective Stackable System

Technical Parameters:

Applications:

The primary application for this precision carrier is the secure and stable handling of optically and structurally complex microelectronic components. It excels in environments where generic handling solutions introduce risk. Key applications include: High-Precision Optical Inspection of lenses or photonic elements, where the tray’s stability and custom fit ensure the component remains perfectly aligned; Prototyping and Engineering Lines for new components with irregular shapes, providing a safe, dedicated carrier from the earliest R&D stages; Die Sorting and Kitting of bare die where terminal isolation is required to prevent electrical shorting; and Safe Global Shipping of extremely fragile or high-value microelectronics, guaranteeing the product transportation is secured against crushing and ESD damage. Its suitability extends beyond semiconductors to managing small, high-value items in sectors like medical parts, watch parts, and gems, where custom support and protection are essential.

Customization:

Customization is the foundation of this product offering. We provide comprehensive engineering support to design a tray that functions as an extension of your process. This includes: Component Support Feature Design, where pockets are contoured to support the device while leaving critical areas exposed or isolated as needed; Material Selection, allowing choice among various conductive resins, specific colors for process coding, or specialized high-temperature plastics; and Physical Specifications, including options for unique reference marks, color coding, or special tray thickness beyond the standard specifications.