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Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Tên thương hiệu: Hiner-pack
Số mẫu: HN25011
MOQ: 500 chiếc
giá bán: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Điều khoản thanh toán: T/T
Khả năng cung cấp: 2000 chiếc / ngày
Thông tin chi tiết
Nguồn gốc:
Trung Quốc
Chứng nhận:
ROHS, ISO
Trọng lượng khay:
Khác nhau, thường lên tới 500 gram mỗi khoang
Màu sắc:
Đen
Đảm bảo chất lượng:
Đảm bảo giao hàng, chất lượng đáng tin cậy
Kích thước khoang:
322,6×135,9×7,62 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Loại khuôn:
tiêm
Tái sử dụng:
Đúng
Hình dạng khay:
hình chữ nhật
lớp học sạch sẽ:
Làm sạch chung và siêu âm
Loại IC:
BGA,QFP,QFN,LGA,PGA
Mức đóng gói:
Gói vận chuyển
Độ phẳng:
Ít hơn 0,76mm
Dung tích:
20x9=180 CÁI
chi tiết đóng gói:
thùng carton, pallet
Khả năng cung cấp:
2000 chiếc / ngày
Mô tả sản phẩm
Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection
Guard delicate semiconductor wafers during production and handling. Sustain clean working environment and block dust particles effectively. Comply with JEDEC standards for reliable industrial use. Seeking trusted tray solutions for wafer packaging and storage?

Integrate seamlessly with automated assembly lines and packaging plants. Perform consistently in wafer transfer and packaging procedures. Adapt smoothly to diverse semiconductor manufacturing processes.

Facilitate safe storage and factory logistics of wafers. Support custom cavity designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits 
  • Strong durable structure
  • Effective dust prevention
  • Safeguard wafer packaging processes
  • Comply with JEDEC standards
  • Flexible customization
Specifications
Brand Hiner-pack
Model HN25011
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 8.5×8.5×0.9 mm
Matrix QTY 20x9=180 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor wafer packaging, component testing, die sorting and semiconductor manufacturing. Fit cleanroom operations, automated assembly lines and packaging plants. Ensure stable performance in rigorous industrial environments.

Also used in wafer storage, factory logistics, production turnover and sample shipment. Serve semiconductor manufacturers, testing institutions and electronic component suppliers.
Customized Services
Offer comprehensive customization services for JEDEC IC trays. Collaborate closely with customers to analyze unique wafer specifications, production workflows, and environmental requirements. Modify cavity dimensions, grid layouts, material selections, and structural designs to perfectly match diverse wafer types and manufacturing scenarios. Provide end-to-end support from prototype testing to final production, delivering personalized tray solutions that enhance production efficiency, minimize contamination risks, and fully address specialized semiconductor manufacturing needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers