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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Tên thương hiệu: Hiner-pack
Số mẫu: HN25004
MOQ: 500 chiếc
giá bán: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Điều khoản thanh toán: T/T
Khả năng cung cấp: 2000 chiếc / ngày
Thông tin chi tiết
Nguồn gốc:
Trung Quốc
Chứng nhận:
ROHS, ISO
Trọng lượng khay:
Khác nhau, thường lên tới 500 gram mỗi khoang
Màu sắc:
Đen
Đảm bảo chất lượng:
Đảm bảo giao hàng, chất lượng đáng tin cậy
Kích thước khoang:
322,6×135,9×7,62 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Loại khuôn:
tiêm
Tái sử dụng:
Đúng
Hình dạng khay:
hình chữ nhật
lớp học sạch sẽ:
Làm sạch chung và siêu âm
Loại IC:
BGA,QFP,QFN,LGA,PGA
Mức đóng gói:
Gói vận chuyển
Độ phẳng:
Ít hơn 0,76mm
Dung tích:
7x23=161 CÁI
chi tiết đóng gói:
thùng carton, pallet
Khả năng cung cấp:
2000 chiếc / ngày
Mô tả sản phẩm
Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
Provide stable protection for delicate wafers throughout packaging processes. Maintain clean working conditions with effective dust control. Built with strong structure to support long-term industrial use. Searching for dependable tray solutions for semiconductor production?

Fit high-standard manufacturing environments and automated production lines. Ensure stable performance during wafer handling and transfer processes. Adapt to various semiconductor packaging procedures smoothly.

Support safe storage and transportation of wafers. Accept customized sizes and structures to meet different production needs. Provide tailored solutions for diverse semiconductor packaging requirements.
Key Features/ Benefits 
  • Strong durable structure
  • Stable wafer protection
  • Safeguard wafer packaging processes
  • Comply with JEDEC standards
  • Flexible customization
Specifications
BrandHiner-pack
ModelHN25004
Material MPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×7.62 mm
Cavity Size13×7.5×7.62 mm
Matrix QTY7x23=161 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Widely used in semiconductor wafer packaging, chip testing, die sorting and device manufacturing. Suitable for cleanroom production, automated assembly lines and high-precision processing workshops. Perfectly match various wafer level packaging processes and ensure stable performance in strict production environments.

Also applied to wafer storage, factory logistics, production turnover and sample delivery. Meet requirements of semiconductor packaging plants, testing centers and electronic component manufacturers. Support safe and efficient operation of the whole semiconductor production and supply chain.
Customized Services
Provide professional customized services for JEDEC IC trays according to customer needs. Support personalized design of cavity size, arrangement and material. Create exclusive tray structures for different wafers and packaging processes. Offer one-stop tailored solutions to improve production efficiency and meet special application requirements in semiconductor manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers