logo
các sản phẩm
Trang Chủ / các sản phẩm / Khay IC JEDEC /

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Tên thương hiệu: Hiner-pack
Số mẫu: HN24220
MOQ: 500 chiếc
giá bán: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Điều khoản thanh toán: T/T
Khả năng cung cấp: 2000 chiếc / ngày
Thông tin chi tiết
Nguồn gốc:
Trung Quốc
Chứng nhận:
ROHS, ISO
Trọng lượng khay:
Khác nhau, thường lên tới 500 gram mỗi khoang
Màu sắc:
Thường có màu đen hoặc xám đen để bảo vệ ESD
Đảm bảo chất lượng:
Đảm bảo giao hàng, chất lượng đáng tin cậy
Kích thước khoang:
4x5x1,6mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Loại khuôn:
tiêm
Tái sử dụng:
Đúng
Hình dạng khay:
hình chữ nhật
lớp học sạch sẽ:
Làm sạch chung và siêu âm
Loại IC:
BGA,QFP,QFN,LGA,PGA
Mức đóng gói:
Gói vận chuyển
Độ phẳng:
Ít hơn 0,76mm
Dung tích:
13x28=364 CÁI
chi tiết đóng gói:
thùng carton, pallet
Khả năng cung cấp:
2000 chiếc / ngày
Làm nổi bật:

180°C high temp JEDEC tray

,

ESD protection JEDEC IC tray

,

semiconductor packaging JEDEC tray

Mô tả sản phẩm
High Temp ESD JEDEC Tray for AI Chips Packaging
This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging.
It ensures dimensional stability and precise positioning during automated handling.
Key Features/ Benefits 
  • Up to 180°C high temperature resistant (PEI material)
  • Stable ESD protection (1E4–1E11 Ω)
  • Compatible with ASM / Advantest / YAMAHA machines
  • Free design within 24 hours
  • JEDEC standard footprint
Specifications
Brand Hiner-pack
Model  HN24220
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 4x5x1.6 mm
Matrix QTY 13x28=364 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
  • AI chips / GPU / ASIC
  • BGA / QFN / IC packaging
  • Burn-in & baking process
  • Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • 10+ years semiconductor packaging experience
  • In-house mold design capability
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Daily capacity: 2000+ pcs